Method of providing spinal interbody fusion
US8535353B2 · kind B2 · utility
22Cited by
108References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2011 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Apr 19, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S606/914
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An apparatus and method is provided for interbody fusion including distracting, in a given direction, and supporting opposing vertebral bodies. A plurality of wafers are consecutively inserted between the vertebral bodies to create a column of wafers. The column of wafers is oriented between the vertebral bodies so as to expand in the given direction as the wafers are consecutively added to the column.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.