High thermal conductivity hardfacing
US8535408B2 · kind B2 · utility
2Cited by
39References
24Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 24, 2012 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Jan 24, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12063
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A hardmetal composition comprises tungsten carbide in an amount greater than 50 weight percent of the hardmetal composition. In addition, the hardmetal composition comprises a binder material consisting of at least 90 weight percent nickel, a binder flux between 3.5 to 10.0 weight percent chosen from the group consisting of boron and silicon, and less than 1.0 weight percent other components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.