Polymer composition for microelectronic assembly
US8535454B2 · kind B2 · utility
0Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2011 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Nov 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.