Patent · US Active

Pressure sensitive shrink label

US8535464B2 · kind B2 · utility

9Cited by

421References

16Claims

0Family size

Assignee

Avery Dennison Corporation · US

Inventors

James P. Lorence · Greenville, US
Craig W. Potter · Mentor, US
Mitchell J. Rackovan · Mentor, US
Richard D. Pastor · Cincinnati, US
William Lewis Cone · Weeki Wachee, US

Key dates

Filing date	Apr 4, 2008
Grant date	Sep 17, 2013
Priority date	—
Expiry date	Nov 1, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/2848
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A label for application to a surface having at least one compound curve is provided. The label comprises a heat shrinkable film having an inner surface and outer surface and a layer of pressure sensitive adhesive on the inner surface of the heat shrinkable film.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.