Resin sheet for circuit board and production process therefor
US8535782B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 1, 2008 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Aug 28, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24777
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resin sheet (100) is provided with a resin layer (120), and a passivation layer (110) laminated on one surface of the resin layer (120). The resin sheet (100) has a rectangular shape in a plan view. The periphery of the passivation layer (110) extends outward from the periphery of the resin layer (120). The resin layer (120) is provided with a flat section (121), and a slope section (122) wherein the thickness of the resin layer (120) gradually reduces toward the outside from the flat section (121). A difference between the resin thickness (d) of the boundary section (123) between the slope section (122) and the flat section (121) of the resin layer (120), and an average thickness (D) of the flat section (121) is 5% or less of the average thickness (D).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.