Bonded member and process for producing the same
US8535789B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2010 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Apr 16, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A microchip plate made such that polymer substrates made, in particular, of a cycloolefin polymer (COP) or a cycloolefin copolymer (COC) can be appropriately bonded to each other and a process for producing the microchip plate are provided. A microchip plate (1) of an embodiment is constituted by a first substrate (2) and a second substrate (3), which are bonded to each other through an adhesive layer (5), wherein the first substrate (2) and the second substrate (3) are formed by a COP or a COC, and the adhesive layer (5) is formed of paraffin or naphthene or formed including paraffin or naphthene and at least any one of an adhesion auxiliary material, a polymer constituting each of the first substrate and the second substrate, and a macromonomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.