Mold- and moisture-resistant gypsum boards
US8535790B2 · kind B2 · utility
4Cited by
22References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2011 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Feb 14, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31996
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Mold- and moisture-resistant gypsum boards and methods for making them are disclosed, the method comprising applying a slurry that forms a gypsum core to an upper or a lower facing sheet impregnated with a thermoset resin (e.g., a phenol-formaldehyde resin) in an amount effective to (i) allow water vapor passage through the facing sheet when the thermoset resin is in its uncured state and (ii) provide mold and moisture resistance to the facing sheet when the thermoset resin is in its cured state and heating sufficiently to cure said resin and dry said gypsum core, thereby yielding said gypsum board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.