Transparent molding composition

US8535811B2 · kind B2 · utility

Assignee

• EVONIK DEGUSSA GMBH · DE

Inventors

• Kirsten Luetzeler · Munster, DE
• Franz-Erich Baumann · Schneverdingen, DE
• Sonja Bollmann · Haltern am See, DE
• Andreas Dowe · Borken, DE
• Roland Wursche · Schneverdingen, DE
• Georg Schaefer · Datteln, DE

Key dates

• Filing date: Jun 1, 2011
• Grant date: Sep 17, 2013
• Expiry date: Jun 1, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31765
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A polyamide molding composition which can be used for production of a printable or printed item contains a) at most 90 parts by weight of a polyamide obtained from a lactam or from an amino carboxylic acid having at least 10 carbon atoms; and b) from 10 to 100 parts by weight of PA1010, wherein a total of components a) and b) is 100 parts by weight.