Use of boron to reduce the thermal conductivity of unbonded loosefill insulation
US8536079B2 · kind B2 · utility
3Cited by
15References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2011 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Dec 26, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C13/06
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An unbonded loosefill insulation material formed from a glass batch is provided. The glass batch comprises, in weight percent: 62.0-69.0% of SiO2, 0.0-4.0% of Al2O3, 7.0-12.0% of CaO, 0.0-5.0% of MgO, 3.0-14.0% of B2O3, 13.0-18.0% of Na2O and 0.0-3.0% of K2O. The unbonded loosefill insulation material is configured for distribution in a blowing insulation machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.