Polyamide resistant to heat aging

US8536247B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Manoranjan Prusty · Mannheim, DE
• Martin Baumert · Dossenheim, DE
• Axel Wilms · Bad Dürkheim, DE
• Philippe Desbois · Maikammer, DE
• Alexander Traut · Schriesheim, DE
• Gerald Lippert · Frankfurt (Oder), DE
• Jordan Kurikov · Mannheim, DE

Key dates

• Filing date: Oct 18, 2010
• Grant date: Sep 17, 2013
• Expiry date: Oct 18, 2030

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K3/08
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding compositions, comprising