Assembled multi-component electronic apparatus using alignment and reference marks
US8536572B2 · kind B2 · utility
2Cited by
34References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 13, 2010 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Dec 3, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.