Repair apparatus and method for circuit board assembly
US8537547B2 · kind B2 · utility
1Cited by
4References
7Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 30, 2010 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Sep 12, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20136
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.