Method of manufacturing electronic device and electronic device
US8537567B2 · kind B2 · utility
1Cited by
4References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 25, 2010 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Apr 22, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electronic device, the method includes: preparing a first lead frame having a first lead, the first lead having a first portion located in a first region; electrically connecting the first lead and a first electronic part; bending the first lead such that the first portion is located outside the first region; arranging a second lead frame to overlap the first lead frame such that a second portion of a second lead of the second lead frame is located in the first region; and electrically connecting the second lead and the second electronic part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.