Method of fabricating touch panel
US8539667B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2010 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Aug 23, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4916
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a touch panel is provided. A substrate having a touch-sensing region and a peripheral region is provided. A touch-sensing circuit layer including first sensing series, second meshed metal sensing pads, and peripheral circuits is formed on the touch-sensing region of the substrate. An insulating layer having first contact windows and second contact windows is formed on the substrate to cover the touch-sensing circuit layer. The first contact windows expose a portion of the second meshed metal sensing pads. A transparent conductive layer including second transparent bridge lines and transparent contact pads is formed on the insulating layer located in the touch-sensing region of the substrate. Each second transparent bridge line is electrically connected to two adjacent second meshed metal sensing pads through two first contact windows. Each transparent contact pad is electrically connected to the corresponding peripheral circuit through the second contact window.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.