Laminated electronic card assembly

US8540165B2 · kind B2 · utility

Assignee

• PRIVASYS, INC. · US

Inventors

• Eric Foo · Thousand Oaks, US
• Joan Ziegler · Tiburon, US
• Mark Poidomani · Holiday, US
• Lawrence Routhenstein · Winter Garden, US
• Ziv Alon · Thousand Oaks, US
• Charles McGuire · Newbury Park, US

Key dates

• Filing date: Apr 3, 2012
• Grant date: Sep 24, 2013
• Expiry date: Apr 3, 2032

Classification

• Technology area (CPC G): Physics
• CPC primary: G07F7/1016
• WIPO field: Control
• WIPO sector: Instruments

Abstract

An electronic card is assembled from top and bottom graphic layers, top and bottom thermal sensitive adhesion tapes and an inlay assembly laminated together. The inlay assembly is made of a sub-assembly of a PCB base with one or more electronic components mounted to it, thermal sensitive adhesion tape and a stiffening substrate, all laminated together, while a battery insert and possible additional inserts made of PVC are mounted in openings in the sub-assembly around electronic components such as the battery. The stiffening substrate has a thermal coefficient substantially the same as that of the PCB base. The card need not contain any solder connections and is ISO 7810 compliant. Lamination is performed at a warm, not hot, temperature that does not damage the battery or melt any components together.