Patent · US Active

Patterned metallization on polyimide aperture plate for laser-ablated nozzel

US8540346B2 · kind B2 · utility

1Cited by
1References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 27, 2011
Grant dateSep 24, 2013
Priority date
Expiry dateJul 24, 2031

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49401
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

An aperture plate for a print head of a printer can include a first layer having a first emissivity which is covered by a second layer having a second emissivity which is less than the first emissivity. In an embodiment, the second layer can be etched at nozzle locations to form openings in the second layer which have widths/areas greater than widths/areas of nozzles formed in the first layer. In another embodiment, the second layer can have a smaller thickness at the nozzle locations and a larger thickness away from the nozzle locations. Forming the openings in the second layer which are larger than the nozzles, or forming the second layer thinner at the nozzle locations prior to forming the nozzles, can provide a well-formed nozzle and an aperture plate having a low emissivity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.