LED housing with heat transfer sink
US8540402B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2011 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Jan 12, 2032 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An illustrative thermally managed light includes a light source, for example an LED array, a heatsink having a tapered outer surface, the light source thermally coupled with the heatsink, a housing having a tapered interior surface portion, and a securing device coupling the heatsink and the rear end of the housing. The securing device, for example a tensioning device, adapted to retain the outer surface of the heatsink in thermal contact with the tapered interior surface of the housing, thus transferring and dissipating the heat from the light source into the environment around the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.