Bonded abrasive tool and method of forming
US8540785B2 · kind B2 · utility
4Cited by
16References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 8, 2012 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Aug 8, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonded abrasive tool includes a bonded abrasive body having a bond matrix material including an organic bond material, abrasive grains contained within the bond matrix material, and chopped fiber bundles within the bond matrix material. The tool further has a porosity within the bonded abrasive body, wherein a majority of the porosity includes pores surrounding the chopped fiber bundles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.