Methods of patterning layered-material and forming imprinting mold
US8540888B1 · kind B1 · utility
2Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2012 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Sep 11, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0042
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is a method of patterning a layered material. A layered material is provided, and a photoresist layer is formed thereon. The photoresist layer is patterned by a focused laser beam to expose a part of the layered material. The exposed layered material is etched to pattern the layered material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.