Electrically conductive paste, and electrical and electronic device comprising the same
US8540903B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2008 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Feb 23, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.