Packaging materials with enhanced thermal-insulating performance
US8541074B2 · kind B2 · utility
7Cited by
44References
47Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 5, 2011 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | May 14, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31996
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A packaging material including a paper-based substrate having a first surface and a second surface and a thermal-insulating composition on the first surface of the substrate, wherein the thermal-insulating composition includes, based on the total weight of the composition, filler in an amount of 20% to 70% by weight, organic binder in an amount of 15% to 70% by weight, and plasticizer in an amount of 0.5% to 10% by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.