Transparent substrates with dielectric layer having a marking below the surface of the transparent substrate
US8541105B2 · kind B2 · utility
0Cited by
4References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2006 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Mar 26, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
This invention concerns a method of producing subsurface marking in a transparent body. According to the invention, the marking is done less than 500 μm below the surface by applying a layer system with a high destruction threshold, compared to the substrate, to the surface of the substrate. If the layer system is designed as an anti-reflection coating system for the reading wavelength, it increases the contrast for reading. If the layer system is designed as a mirror for the writing wavelength, the writing can be done in reflection at a lower intensity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.