Overmolded thermal interface for use with a battery cooling system
US8541127B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2011 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Apr 4, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A cooling manifold assembly for use in a battery pack thermal management system is provided. The cooling manifold assembly includes a coolant tube that is interposed between at least a first row of cells and a second row of cells, where the first and second rows of cells are adjacent and preferably offset from one another. A thermal interface layer is overmolded onto the cooling tube, the thermal interface layer including a plurality of pliable fingers that extend away from the cooling tube and are interposed between the cooling tube and the first row of cells, and interposed between the cooling tube and the second row of cells, where the pliable fingers are deflected by, and in thermal contact with, the cells of the first and second rows of cells.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.