Resin film forming method
US8541165B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 8, 2011 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Dec 1, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/022
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A resin film forming method for forming a resin film on a substrate includes forming an intermediate layer on the substrate which includes an inorganic composition as a main component to chemically bond the resin film to be formed on the substrate to the substrate, carrying out a treatment on the substrate to remove an edge of the intermediate layer from an edge of the substrate, forming the resin film on the substrate by spin coating, chemically bonding the resin film to the substrate and hardening the resin film, and removing an edge of the resin film from the edge of the substrate by applying vibrations to the hardened resin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.