Copolymerized polyether polyamide resin
US8541321B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2008 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Sep 23, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2811
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A copolymerized polyether polyamide resin for coating on or for impregnation to a woven or knitted fabric, wherein elongation and elastic modulus of the copolymerized polyether polyamide resin are not less than 1000% and not more than 15 MPa, respectively. The copolymerized polyether polyamide resin has a constitution wherein said copolymerized polyether polyamide resin is such that a soft segment comprising a polyether polyamide constituted from a polyether diamine compound and a dicarboxylic acid compound is bonded to a hard segment comprising a polyamide constituted from an aminocarboxylic acid compound and/or a lactam compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.