Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component
US8541690B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2007 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | May 30, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for fixing an electronic component on a printed circuit board, and contact-connecting the electronic component to the printed circuit board, the following steps are provided:—providing the printed circuit board having a plurality of contact and connection pads,—providing the electronic component having a number of contact and connection locations corresponding to the plurality of contact and connection pads, with a mutual spacing reduced in comparison with the spacing of the contact and connection pads, and—arranging or forming at least one interlayer for routing the contact and connection locations of the electronic component between the contact and connection pads and the contact and connection locations of the electronic component. A method for producing an interlayer for routing and a system having a printed circuit board and an electronic component using the interlayer for routing are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.