Mounting substrate and manufacturing method thereof, light-emitting module and illumination device
US8541805B2 · kind B2 · utility
3Cited by
2References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2011 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Apr 27, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/263
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate according to the present invention includes a substrate and a reflective film that is formed on a front surface of the substrate and has a front surface on which LED chips are to be mounted, and the reflective film is made of metal oxide microparticles and a glass frit, and reflects light from the LED chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.