Vertically mounted multi-hybrid module and heat sink
US8542490B2 · kind B2 · utility
3Cited by
24References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2011 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Feb 3, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-hybrid module includes a plurality of hybrid assemblies that are perpendicularly mounted with respect to a plane of a circuit board. The hybrid assemblies are mounted on opposing sides of a heat sink. The heat sink has a first column disposed at a first end, a second column disposed at a second opposing end, and a generally flat center wall extending between the first column and the second column to which the hybrid assemblies are mounted. During operation the hybrid assemblies are mounted on edge perpendicular with respect to the circuit board to minimize an area profile of the multi-hybrid module on the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.