Packages for high power operation of optical fiber components
US8542971B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 25, 2009 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Nov 7, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package for dissipating heat power and/or optical power from an optical fiber component of a device is provided. The package includes a heat sink packaging receptacle for accommodating the optical fiber component having a cavity for receiving a temperature sensitive portion of the optical fiber component. According to one aspect, the package may include a power-dissipative material for dissipating heat power or optical power, the power-dissipative material extending within the cavity and surrounding the temperature-sensitive portion of the optical fiber component. According to another aspect, the package may include at least one channel extending between the cavity and an end of the heat sink packaging receptacle, the channel being in intimate contact with the cladding of the optical fiber component for dissipating heat power and/or optical power from the optical fiber component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.