Inductive coil device on flexible substrate
US8543190B2 · kind B2 · utility
29Cited by
3References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2010 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Jul 13, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49071
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A device includes a flexible substrate, N coiled conductors, and a plurality of folding regions. The N coiled conductors are deposited on the flexible substrate and connected in series by conductive interconnects. N is greater than 1. Each of the folding regions is defined by a separation distance between adjacent ones of the N coiled conductors. The conductive interconnects traverse the folding regions between the N coiled conductors to connect the N coiled conductors in series. The flexible substrate is folded such that the N coiled conductors form a stack of N coiled conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.