Heat dissipation device and method for manufacturing the same
US8544530B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Aug 4, 2009 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Jun 30, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipation device includes a plurality of fins, a plurality of heat pipes connected to the fins in a thermal conductive relationship and a plurality of electric conductors extending through the fins. The fins are stacked together and spaced from each other. The heat pipes are extended through the fins. The electric conductors are electrically connected to the fins to enable consistent metal oxide films to be formed all over surfaces of the fins when anodizing the fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.