Patent · US Active

Method of receiving a module in a smart card body

US8544756B2 · kind B2 · utility

3Cited by

6References

17Claims

0Family size

Assignee

OBERTHUR TECHNOLOGIES · FR

Inventors

Olivier Bosquet · Colombes, FR
Mourad Laknin · Levallois-Perret, FR
Denis Vere · Vitré, FR

Key dates

Filing date	Dec 5, 2011
Grant date	Oct 1, 2013
Priority date	—
Expiry date	Dec 5, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/10
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

The smart card comprises a module having a microcircuit and a body including a cavity for receiving the module, wherein the cavity defines at least one surface area for fastening the module in the cavity, the body being formed by a stack of at least first and second layers respectively presenting weak adhesion and strong adhesion with the module. The area extends in the weak adhesion layer and includes at least one hole leading to the strong adhesion layer so as to form an anchor point for the module directly with said layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.