Thermal sensor device and method of assembly
US8545096B2 · kind B2 · utility
13Cited by
11References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 6, 2009 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Jan 3, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K1/18
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal sensor having a robust mechanical connection between a thermal sensor housing and thermal sensor tube is provided having a cross-sectional shape configured to provide a reduced thermal conductivity between the sensor and the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.