Flexible fiber to wafer interface
US8545108B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2012 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Apr 23, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A fiber to wafer interface system includes an interface device comprising a flexible substrate portion, a flexible cladding portion arranged on the substrate portion, a flexible single-mode waveguide portion arranged on the cladding portion including a substantially optically transparent material, a connector portion engaging a first distal end of the flexible substrate portion, the connector portion operative to engage a portion of an optical fiber ferrule, a wafer portion comprising a single mode waveguide portion arranged on a portion of the wafer, an adhesive disposed between a portion of the single mode waveguide portion of the body portion and the single mode waveguide portion of the wafer portion, the adhesive securing the body portion to the wafer portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.