Patent · US Active

Swing out mold insert device on lay up molds

US8545662B2 · kind B2 · utility

2Cited by

10References

20Claims

0Family size

Assignee

Weber Manufacturing Technologies Inc. · CA

Inventors

Paul D. Jagos · Midland, CA
Curtis Spencer Quesnelle · Midland, CA
Thomas Schmitz · Wesseling, DE

Key dates

Filing date	Jul 11, 2012
Grant date	Oct 1, 2013
Priority date	—
Expiry date	Aug 4, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/15
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

An apparatus and method in which an insert with an undercut is mechanically coupled to a lay up mold for translated movement between an engaged position for molding with an undercut engaging the material to be molded and a remote position in which a resultant molded product maybe removed and the material may be laid up without interference with the undercut, preferably with the mechanical coupling allowing for hinged movement of the insert relative the lay up mold.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.