Conductive paste and conductive circuit board produced therewith
US8545731B2 · kind B2 · utility
3Cited by
0References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2011 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Jun 7, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0323
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conductive paste containing silver nanoparticles and a conductive circuit board provided therewith are provided. The conductive paste containing silver nanoparticles includes 15 to 50 weight % of silver nanoparticles based on a total weight of the conductive paste, the silver nanoparticles having an average particle size of 1 to 100 nm; 0.1 to 2.5 weight % of carbon nanotubes based on the total weight of the conductive paste, the carbon nanotubes having an average diameter of 2 to 40 nm; 1 to 15 weight % of a binder based on the total weight of the conductive paste; and a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.