Method for improving the bonding properties of microstructured substrates, and devices prepared with this method
US8545770B2 · kind B2 · utility
6Cited by
12References
15Claims
0Family size
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Key dates
| Filing date | Dec 11, 2007 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Mar 26, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24744
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for treating the surface of a polymerio substrate, including the following steps: providing a first polymeric substrate; contracting at least one part of one face of the first substrate with some liquid solvent system, the liquid solvent system containing at least a first volatile compound and at least a second compound having a low molecular weight and able to swell and/or soften the polymeric material forming the face; letting at least the volatile compound to evaporate from the face of the first substrate and; contracting the so-treated face of first substrate with a third material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.