Process for preparing, prior to filling, a wafer cornet, cornet thus obtained and installation for implementing the process
US8545913B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2005 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Jan 19, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65B7/18
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Process for preparing a cornet consisting of a substantially conical wafer (22) prior to the filling of said cornet with an ice-cream; in order to preserve the crunchy nature of the wafer, the inner wall of the cornet is sprayed with liquid chocolate (23); this chocolate solidifies rapidly in order to form a coating layer for separating the wafer and the ice-cream. The process is characterized in that the inside of the cornet is sprayed with an excess quantity of chocolate to guarantee that no coating-gap zone remains on the inner wall of the wafer, the excess liquid chocolate collecting, under gravity, at the bottom tip of the corner; prior to solidification of said excess, the excess is sucked out of the cornet, subsequent solidification of the coating layer thus making it possible to establish a continuous barrier over the inner wall of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.