Method for applying a liquid coating material to a substrate
US8545929B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2011 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Oct 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0126
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Systems and methods for applying liquid coating materials to a substrate, such as an electronic component or circuit board. A control system of a coating system controls an applicator and a robot moving the applicator to apply the liquid coating material to the substrate in accordance with the information contained in a coating program. The control system determines a volume of liquid coating material actually dispensed onto the substrate during the coating program, and compares the dispensed volume to a desired dispensed volume of liquid coating material to produce an error signal representing the difference between the calculated and desired volume values. The control system uses the error signal to change the dispensed volume of liquid coating material on a subsequent substrate by a future coating program.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.