Method and device for the infiltration of a structure of a porous material by chemical vapour deposition
US8545939B2 · kind B2 · utility
1Cited by
2References
10Claims
0Family size
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Key dates
| Filing date | Jul 22, 2008 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Oct 6, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/458
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and a device for infiltration of a structure made of a porous material by chemical vapor deposition. According to the method, a first face of the porous material structure is exposed to a gaseous flow, and the second face is maintained at least partially free from any contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.