Thermal interface material with thin transfer film or metallization
US8545987B2 · kind B2 · utility
19Cited by
54References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2007 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Sep 12, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0.0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.