Patent · US Active

Electrode arrays and methods of fabricating the same using printing plates to arrange particles in an array

US8546257B2 · kind B2 · utility

2Cited by

9References

10Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Tobias Kraus · Riegelsberg, DE
Laurent Malaquin · Linas, FR
Heiko Wolf · Thalwil, CH

Key dates

Filing date	Jul 17, 2012
Grant date	Oct 1, 2013
Priority date	—
Expiry date	Jul 17, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/01079
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.