Seam position control for laser processing
US8546721B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2008 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Oct 18, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A course of a position of a positioning device is determined as a laser beam welds a workpiece at a focus area of the laser beam. The positioning device is configured to position the focus area of a laser beam on a workpiece such that a joint is formed on the workpiece. A course of the joint on the workpiece from the determined course of the position of the positioning device is estimated, and a deviation between the determined course of the position of the positioning device and the estimated course of the joint on the workpiece is calculated. The deviation represents a parameter related to the precision of the seam position control.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.