LED package and light emitting device having the same

US8546833B2 · kind B2 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• CHAO-HSIUNG CHANG · Hsinchu, TW
• HOU-TE LIN · Hsinchu, TW

Key dates

• Filing date: Aug 15, 2012
• Grant date: Oct 1, 2013
• Expiry date: Aug 15, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857

Abstract

An exemplary LED package includes first and second electrodes, an LED die and an encapsulation. An inner wall of each first and second electrode includes a first oblique plane. The LED die is surrounded by and electrically connected to the first and second electrodes. The LED die includes an outputting surface. The encapsulation is filled between the first electrode ant the second electrode and covers the LED die, and includes opposite first and second outer surfaces, wherein the second outer surface acts as an outputting surface of the LED package. A reflective layer is coated on the first outer surface of the encapsulation. The first oblique plane of the electrode structure is light reflective and extends aslant from the outputting surface of the LED die towards the outputting surface of the LED package along a direction away from the LED die.