RF module including control IC without the aid of a relay pad
US8546939B2 · kind B2 · utility
2Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2006 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Dec 5, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technology is provided so that RF modules used for cellular phones etc. can be reduced in size. Over a wiring board constituting an RF module, there are provided a first semiconductor chip in which an amplifier circuit is formed and a second semiconductor chip in which a control circuit for controlling the amplifier circuit is formed. A bonding pad over the second semiconductor chip is connected with a bonding pad over the first semiconductor chip directly by a wire without using a relay pad. In this regard, the bonding pad formed over the first semiconductor chip is not square but rectangular (oblong).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.