Pressure-sensitive adhesive sheet for protecting semiconductor wafer
US8546958B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2011 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Sep 5, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2475/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.