Optical element module and method of manufacturing the same
US8548284B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2009 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Apr 4, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of manufacturing an optical element module 1 in which an optical element 8 and a semiconductor circuit element 9 are mounted on one surface of a silicon substrate 2, a mirror surface 2a inclined at approximately 45 degrees is formed on the other surface, and an optical fiber 7 facing the mirror surface is disposed in a V groove formed along the other surface, the method of manufacturing includes the steps of forming the mirror surface 2a and V-shaped side surfaces of the V groove simultaneously by first crystal anisotropic etching on the other surface, and forming an attaching surface 2b substantially perpendicular to the one surface and the other surface, which is formed at an end side of the V groove, and for attaching an end of the optical fiber 7, by second crystal anisotropic etching in a crystal plane orientation different from that of the first crystal anisotropic etching. Thereby, it is possible to realize an optical element module including an optical element that receives light or emits light, a semiconductor circuit element, and an optical fiber optically connected to the optical element, the optical element module highly-functionally performs an optical connect…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.