Method and system for implementing core placement
US8549457B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2011 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Aug 26, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2113/18
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an improved method, system, and computer program product for performing core placement when presented with an I/O ring design. A multi-pass approach is taken to place and shape core objects into the available core area formed by the inner surface of the I/O ring. The multi-pass approach permits very fast placement of the core objects, which still provides for an accurate estimation of the die size and configuration requirements for the electronic design. Moreover, the present approach allows core objects to be placed in a way that retains any preferred affinities for the objects to be located near other objects, e.g., near specific I/Os on the I/O ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.