Suspension method for compliant thermal contact of electronics modules
US8549741B2 · kind B2 · utility
8Cited by
17References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2009 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | Jul 27, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49133
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A communication module is provided. In one embodiment, the communication module includes at least one transceiver, a filter communicatively coupled with the at least one transceiver, a power amplifier communicatively coupled to the at least one transceiver and the filter, a primary module chassis configured to hold the at least one transceiver, the filter, and the power amplifier, and a filter suspension frame assembly attached to the primary module chassis. The filter suspension frame assembly is configured to float the at least one transceiver in relation to the primary module chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.