Floor panel and methods for manufacturing floor panels
US8549807B2 · kind B2 · utility
29Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2011 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | Apr 28, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24777
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a method for manufacturing floor panels that have at least a substrate and a top layer provided on the substrate, the top layer including a thermoplastic layer that is translucent or transparent, the method may involve providing the top layer, including the thermoplastic layer, on the substrate. The method may also involve heating at least the thermoplastic layer, and structuring the thermoplastic layer using a mechanical press element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.